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L30960-N1531-B200 EGS5-X Evaluation Module

L30960-N1531-B200 EGS5-X Evaluation Module

COMe Ref.Carrier-i T6 TMIE

1522,13 zł 1237,50 zł
Wkrótce dostępny
Kod produktu:
38115-0000-00-2
Brak produktu na stanie

Processor 
Via COMe basic/compact Type 6 module

Main Memory 
Via COMe basic/compact Type 6 module

PCI Express / PCI support 
Three PCIe interfaces:
» PCIe#0 for Mini PCIe 2.0 half-size card slot connected to the SIM card slot,J24
» PCIe#1 for Mini PCIe 2.0 full-size card slot muxed with SATA#1 (mSATA) and connected to the SIM card slot, J21
» PCIe#2 for the onboard Gigabit Ethernet controller

SATA 
Four SATA 6 Gb/s interfaces:
» SATA#0 via the 22-pin SATA plug connector (with redriver ICs), J5
» SATA#1 for the mSATA socket / Mini PCIe full-size card slot (with redriver ICs), J21
» SATA#2 muxed with PEG#0 for the M.2 interface (with redriver ICs)
» SATA#3 via the 22-pin SATA receptacle connector (with redriver ICs), J33

Ethernet 
Two Gigabit Ethernet interfaces:
» GbE#0 on RJ45 connector, J18, via COMe basic/compact Type 6 module
» GbE#1 on RJ45 connector, J20, via the onboard GbE controller (Intel® Ethernet Controller I210-IT)

Audio 
Four HD Audio interfaces:
» Rear panel line-in connector, J25
» Rear panel SPK/line-out connector, J26
» Front panel HD audio header, J22
» S/PDIF header, J23

Power Supply 
Power input 1: 12V only
Power input 2: 8.5V - 30V wide input range

BIOS 
Via COMe basic/compact Type 6 module

Temperature 
Operational: -40°C to +85°C
Storage: -40°C to +85°C
Note: When additional components are installed, refer to their operational specifications as this will influence the operational and storage
temperature of the COMe Ref. Carrier-i T6 TMI

Humidity 
93% RH at 40 °C, non-condensing (acc. to IEC 60068-2-78)

Form Factor 
COM Express® carrier, pinout Type 6, Thin-mITX form factor

Dimensions (H x W x D) 
170 mm x 170 mm (mITX)
Max. component height:
Top side: 16.2 mm
Bottom side: 5.4 mm